PHENOLIC RESIN FOR CCL & PACKAGING

We also offer phenolic resins as a hardening agent for the electronic industry. They offer good mechanical strength, dimensional/thermal stability, and resistance to electricity, solvent, and acid. They are widely used in molding materials (including electronic packaging materials), laminate materials, and impregnation.

Electronic packaging

Hardening agent for epoxy-based encapsulation/packaging material.

Copper clad laminate

Hardening agent in the laminated board impregnated with resin.

Hardeners

1. Phenol novolac type hardener.

2. BPA novolac type hardener.

3. Special type hardener.